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UEW 155 grade solderability polyurethane enamelled copper wire

Enameled wire is an indispensable material in modern society such as vibrant electrical appliances, electronic machines, motors, transformers, relays and even automotive parts. Chalco has various types of enameled wires, including enameled aluminum wire, enameled copper wire, enameled copper clad aluminum wire, high-tension wire, magnetic wire, stranded wire, etc. Chalco's special enameled flat wire is suitable for high-precision coils and has won the trust of the industry.

UEW 155 grade solderability polyurethane enamelled copper wire

UEW 155 grade solderability polyurethane enamelled copper wire is a modified polyurethane enameled copper wire with a temperature resistance grade of F, high mechanical strength, good elasticity, scratch resistance, adhesion, electrical properties and solvent resistance. It is used in various motors, electrical appliances, On instruments, telecommunications equipment and home appliances; the weaknesses of this product are poor thermal shock resistance and low moisture resistance.

Characteristics of UEW 155 grade solderability polyurethane enamelled copper wire:

Softening breakdown temperature is higher than UEW/130;

Easy to dye;

Low dielectric loss at high frequency;

No salt water pinhole

Application:

Relays, micro-motors, small transformers, ignition coils, water stop valves, magnetic heads, coils for communication equipment.

General Introduction

Heat resistance

Electrical performance

Mechanical behavior

Standard

NEMA MW 79-C
IEC60317-20
GB/T6109.10

Temperature index (°C)

≥155

Film continuity standard requirement
(Low pressure G1 0.050mm)

≤6

Elongation standard(0.050mm)

≥10%

Diameter

0.016-0.800

Softening breakdown temperature (°C) standard requirement

≥200

Typical value
(G1 0.050mm)

0

Typical value (0.050mm)

20%

Temperature index (°C)

155

Typical value (°C) (0.050mm)

230

Standard requirements (IEC)
(High pressure G1 0.250mm)

≤40

Elongation standard(0.250mm)

≥22%

Softening breakdown temperature (°C)

200

Thermal shock temperature (°C) standard requirement

175

Typical value
(High pressure G1 0.250mm)

0

Typical value (0.050mm)

35%

Thermal shock temperature (°C)

175

Typical value(0.050mm)

190

Breakdown voltage per micrometer

 

 

 

Solderability

380℃/2s Solderable

Typical value(0.250mm)

190

Typical value (0.050mm)

210

 

 

 

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