Copper aluminum sheet for radiator substrate

With the development of lightweight and miniaturization in electronics, communication and transportation industries, the heat dissipation problem of high energy density is becoming more and more prominent. For example, electric vehicle inverter conversion, PLC chip heat dissipation, high-power LED searchlight all produce huge heat in very small volume. However, the traditional thermal conductive materials such as copper and aluminum are difficult to meet the needs, and the cost of the best thermal conductive and heat dissipation material, silver, is too high to be industrialized.

copper aluminum sheet for radiator substrate

The copper aluminum sheet for radiator substrate developed by Henan Chalco was simulated by numerical simulation. The high-power copper-aluminum composite radiator was fabricated by semi-melting rolling process.

Features: The miniaturization and lightening of energy density can be achieved by distributing the best two metals, namely, high thermal conductivity of copper and high heat dissipation of aluminum.

Product Application: copper aluminum sheet for radiator substrate is used in radiators and radiation modules of industrial appliances, LED, PC, new energy vehicles and other industries.

Thickness

Width

Temper

Bonding strength

Copper ratio

Tensile strength

Elongation

Cladding type

4-15mm

300--500mm

O/H24

≥12N/mm

10%-25%

160-260MPa

10-35%

Overlay cladding

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Hello! If you are interested in our products and leave your demand, we will give you an accounting quotation in time.
Or you can send your request to our email address: info@chalcoaluminum.com

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  • 0086-371- 55689814 55686476
  • info@chalcoaluminum.com
  • 126#4 Building A,No.89 Science Avenue,National HI-Tech Industry Development Zone,Zhengzhou,Henan
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